In-House Photolithography Services


0.25 micron line space

0.25 micron contact

Blanket Spins

Repeatable, Uniform Coatings for characterization and optimization of etch processes

Pre-etch and post-etch thickness data packages available

Photoresist Stripping

Wet Chemical
Plasma Ashing

Process Integration

TFI proess consultants will design your multiple step process for you

On Site SEM Analysis

SEM Resist Profile to insure quality

X-Sectional and Top Down
SEM in-house systems

Pick Up and Delivery

5 Day Turn Time Available

AVAILABLE WAFER SERVICES

ETCH
Wet Chemical

Thermal Oxide
SiO2

LPCVD
Poly Silicon
TEOS
BPSG
Nitride

PVD
Al
Al-Si
Al-Si-Cu

Cu

Ta
TaN

Ti
TiN

W
WSi

Many Other Services Available

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